• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    PURPOSE: A sand blaster is provided to uniformly keep etching rate by uniformly mixing new sand powder and used sand powder. CONSTITUTION: In a sand blaster, a sand storing unit(80) has an opening/closing unit(81) connected to one side of a sand supply unit(40), and selectively supplies new sand powder to the sand supply unit. A sensor unit(70) is installed at the sand supply unit, and measures the amount of sand powder. A control unit(90) controls the opening/closing unit according to a signal output from the sensor unit. The sensor unit includes a first sensor installed at the sand supply unit, and a second sensor installed above the first sensor.
    公开号:KR20040071358A
    申请号:KR1020030007280
    申请日:2003-02-05
    公开日:2004-08-12
    发明作者:김종석；좌성훈
    申请人:삼성전자주식회사；
    IPC主号:
    专利说明:

    Sand Blaster {SAND BLASTER}
    [13] BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to sand blaster, and more particularly to a sand blaster that maintains a constant etching rate.
    [14] In general, sandblaster sprays sand powder made of natural silica sand, alumina or silicon carbide powder, glass beads, micro steel balls, etc. at high speed with a fluid such as air to process a workpiece smoothly, or a steel structure It is used in various places such as removing contaminants on the surface before painting, finely processing the surface of the glass, which is widely used for interior and exterior decoration of masonry or buildings, and engraving patterns or removing paint rust such as ship bridges. Device.
    [15] In recent years, microelectro-mechanical system (MEMS) process has been used as a device for processing or etching holes in the glass wafer.
    [16] FIG. 1 is a side view schematically illustrating a sand blaster generally used in a conventional MEMS, and will be described with reference to the sand blaster.
    [17] In FIG. 1, reference numeral 10 denotes a spray gun, 20 denotes a compressor, 30 denotes a dust collecting unit, 40 denotes a sand supply unit, 50 denotes a separator, and 60 denotes an air pump.
    [18] The high pressure compressed air is supplied to the first air pipe 21 side of the injection gun 10 by the compressor 20 through the air valve 23. In addition, sand powder is supplied from the sand supply part 40 to the sand supply path 11 side through the sand supply pipe 41. At this time, the high pressure compressed air is ejected from the first air pipe 21 and the sand supply passage 11 side becomes negative pressure. Therefore, the sand is ejected from the sand supply passage 11 by the negative pressure to etch the glass wafer on the work plate 15 together with the high pressure compressed air.
    [19] After such an etching process, residues of the etched glass wafers (hereinafter referred to as "residues") and sand powder are accumulated in the dust collecting hopper 31 of the dust collecting unit 30. Meanwhile, the compressed air of high pressure is supplied to the second air pipe 22 through the air valve 23 by the compressor 20, and the compressed air supplied to the second air pipe 22 is directed to the recovery pipe 35. Supplied. At this time, the discharge port 31a side of the dust collection hopper 31 becomes negative pressure by the compressed air supplied to the recovery pipe 35, and sand powder and the residue are sent to the separator 50 side together with the compressed air by the negative pressure.
    [20] The sand powder and the residue sent to the separator 50 side are separated from each other, and the sand powder is recovered to the sand supply unit 40 along the downcoming path 52, and the sand powder which has been worn out among the used sand powder is filtered along with the residue. It is moved to the 61 side. At this time, after the residue and the sand powder are filtered, the compressed air is discharged to the outside of the system, the filtered residue is accumulated in the residue storage unit 63 installed in the lower portion of the filter 61.
    [21] The sand blaster thus constructed does not have a constant etching rate because the purpose was not to etch a workpiece in a certain amount, but to remove or engrave contaminants on the surface. In the conventional sandblaster, when holes are made in the glass wafer, the sand powder for etching the glass wafer is first filtered and then filtered through the filter so that the glass powder is removed and the used sand powder is used for etching the glass wafer again. . After the etching process is repeatedly performed, the existing sand powder is discarded and new sand powder is newly supplied to proceed with the etching process.
    [22] Such a conventional sand blaster, as shown in FIG. 2, as the number of times of use of the sand powder increases, the granules of the sand powder is in a state as shown in FIG. 4, for example, as shown in FIG. Cracking or abrasion increases the time taken to etch the workpiece to a predetermined depth. That is, the etching rate continues to fall.
    [23] Therefore, there is a problem in the MEMS process that requires precise etching because the etching rate when the new sand powder is supplied and the etching rate by the existing sand powder is not constant.
    [24] In addition, when processing glass wafers, it is necessary to take out samples and check how much the etching continues during the operation, and when using a new powder, the etching process takes longer because the etching rate is different. There is a problem.
    [25] The present invention has been devised in view of the above, and continues to automatically supply new sand powder without the procedure of visually checking to maintain a constant mixing ratio of the new sand powder and the existing sand powder constant sand blaster with a constant etching rate The purpose is to provide.
    [1] 1 is a side view schematically showing a conventional sandblaster,
    [2] 2 is a view showing an etching speed of a conventional general sand blaster,
    [3] 3a and 3b is an enlarged view showing a state before and after the process of the sand powder of the conventional general sand blaster,
    [4] Figure 4 is a side view schematically showing a sand blaster according to an embodiment of the present invention.
    [5] <Description of Symbols for Major Parts of Drawings>
    [6] 10: injection gun 20: compressor
    [7] 30: dust collector 31: dust collector hopper
    [8] 40: sand supply unit 50: separator
    [9] 60: air pump 70: sensor
    [10] 71: first sensor 72: second sensor
    [11] 80: sand storage portion 81: opening and closing portion
    [12] 90: control unit
    [26] Sand blaster according to the present invention for achieving the above object is,
    [27] An injection gun for spraying sand powder on the work plate by etching and etching, a sand supply unit for supplying sand powder to the spray gun side, a separator for separating sand powder and dust of the workpiece, and a sand separated by the separator CLAIMS 1. A sand blaster including a descending path in which powder is moved to the sand supply unit, comprising: a sand storage unit including an opening and closing unit for selectively supplying new sand powder to the sand supply unit side; A sensor unit installed in the sand supply unit to measure an amount of sand powder; And a control unit controlling the opening and closing unit according to the signal of the sensor unit.
    [28] According to a preferred embodiment of the present invention, the sensor unit includes a first sensor unit installed at a predetermined position of the sand supply unit; and a second sensor unit installed at a predetermined position above the first sensor unit.
    [29] Here, the opening and closing portion is connected to one side of the descending path.
    [30] In addition, the opening and closing portion may be connected to one side of the sand supply.
    [31] The above objects and other features will become more apparent by describing the preferred embodiment of the present invention with reference to the accompanying drawings. For reference, in describing the embodiments of the present invention, the same reference numerals refer to the same parts as those in the related art.
    [32] 4 is a view schematically showing a sand blaster according to an embodiment of the present invention, wherein reference numeral 10 is a spray gun, 20 is a compressor, 30 is a dust collector, 40 is a sand supply unit, 50 is a separator, and 60 is an air pump. , 70 denotes a sensor unit, 80 denotes a sand storage unit, and 90 denotes a control unit.
    [33] The injection gun 10 ejects sand powder by using high pressure compressed air to etch the glass wafer, and includes an air injection port 12 formed at the tip of the first air pipe 21 to which high pressure compressed air is supplied, and sand A sand supply passage 11 through which the powder is supplied and a sand injection port 11a formed at the tip of the sand supply passage 11 are included.
    [34] The dust collecting unit 30 is installed at a position where the sand powder after the etching process and the glass residues removed by etching are dropped by its own weight, and a dust collecting hopper 31 is formed at a lower portion thereof through a recovery pipe 35 to be described later. It is connected to the (50) side.
    [35] The recovery pipe 35 connects the dust collecting hopper 31 and the separator 50, and one end of the recovery pipe 35 is connected to the second air pipe 22 that receives the compressed air of the high pressure from the compressor 20, and the other end thereof is a separator ( 50). By the high pressure compressed air from the compressor, the sand powder and the residue accumulated in the dust collection hopper 31 are moved along the recovery pipe 35 to the separator 50 side.
    [36] The separator 50 has a lower passage 52 connected to the lower portion thereof, and the discharge passage 51 is connected to the other side thereof. The sand powder and the residue are separated by the separator 50, and the sand powder is recovered to the sand supply unit 40, and the residue is moved to the discharge path 51 by the air pump 60. At this time, the sand powder is worn out of the used sand powder is not separated by the separator 50 is moved to the discharge path 51 with the residue.
    [37] The air pump 60 sucks the air containing the residues through the discharge passage 51, and a filter 61 is installed between the air pump 60 and the discharge passage 51 so that the air is discharged to the outside. The residue is filtered by filter 61 before.
    [38] The sand supply unit 40 is connected to the sand supply pipe 41 to supply sand powder to the injection gun 10 side. In addition, the upper side is connected to the descending path 52, the sand powder separated from the residue by the separator 50 is recovered back to the sand supply unit 40 by its own weight.
    [39] The sensor unit 70 is installed in the sand supply unit 40 to check the amount of sand powder in the sand supply unit 40. According to a preferred embodiment of the present invention, the sensor unit 70 is provided to the first sensor 71 which is installed in the sand supply unit 40 at a predetermined position, and is installed above the first sensor 71 at a predetermined position. And a second sensor 72.
    [40] The sand storage unit 80 is installed at a position adjacent to the downhill 52, and the opening and closing portion 81 of the sand storage unit 80 is connected to one side of the downturn 52. Therefore, when the opening and closing part 81 is opened, new sand powder is supplied to the sand supply part 40 through the lowering path 52, and when the opening and closing part 81 is closed, the supply of new sand powder is stopped.
    [41] The controller 90 receives the signals transmitted by the first sensor 71 and the second sensor 72 and controls the opening and closing portion 81 of the sand storage unit 80 accordingly.
    [42] Looking at the operation of the sensor unit 70, the sand storage unit 80 and the control unit 90 in detail, if the height of the sand powder is lower than the first sensor 71 installed in the sand supply unit 40, the control unit 90 Opens the opening and closing portion 81 of the sand storage unit 80 to supply the new sand powder to the sand supply unit 40 through the lower passage (52). When the new sand powder is supplied and accumulated in the sand supply unit 40, and the height is higher than that of the second sensor 72, the control unit 90 closes the opening and closing unit 81 of the sand storage unit 80 to supply new sand powder. Stop. Thereafter, as the etching process proceeds, the sand powder, which is worn out, is moved toward the discharge path 51, and thus, when the sand powder of the sand supply part 40 is lower than that of the first sensor 71, the sand powder is gradually exhausted. The operation as described above continues to supply the sand powder.
    [43] In the description of an embodiment of the present invention, the case in which the opening and closing portion 81 of the sand storage unit 80 is connected to the descending path 52 has been described. However, the present invention is not limited thereto and may be directly connected to the sand supply unit 40. Do.
    [44] Hereinafter, the operation of the sand blaster according to an embodiment of the present invention will be briefly described with reference to FIG. 4.
    [45] The sand powder is supplied to the injection gun 10 side through the sand supply pipe 41 by the sand supply unit 40, and the compressed air of high pressure is blown through the first air pipe 21 by the compressor 20. It is supplied to the side. At this time, when the high-pressure compressed air is ejected to the air injection port 12 through the first air pipe 21, the tip of the sand injection port 11a formed at the tip of the sand supply passage 11 becomes negative pressure, and sand powder The high pressure compressed air is blown together to etch the glass wafer on the work plate 15.
    [46] After the etching process, the sand powder and the glass residue are collected by the dust collecting unit 30, accumulated in the dust collecting hopper 31, and moved to the separator 50 through the collecting pipe 35 connected to the lower side of the dust collecting hopper 31. At this time, the compressed air of high pressure is supplied to the recovery pipe 35 through the second air pipe 22 by the compressor 20, and the lower side of the dust collecting hopper 31 becomes negative pressure. Therefore, the sand powder and the residue of the dust collection hopper 31 are moved to the separator 50 along the recovery pipe 35 along with the compressed air.
    [47] The residue separated from the sand powder by the separator 50 is moved to the filter 61 side along the discharge path 51 by the air pump 60 and filtered, and then the air is discharged to the outside of the sand blaster.
    [48] On the other hand, the sand powder separated from the residue by the separator 50 is stored back to the sand supply unit 40 along the downcoming path 52 is subjected to the etching process as described above. As the etching process progresses, when the sand powder is located at a position lower than the first sensor 71 while the sand powder of the sand supply unit 40 is exhausted, the opening and closing unit of the sand storage unit 80 is controlled by the controller 90. 81 is opened and fresh sand powder is supplied to the sand supply 40. At this time, while the new sand powder and the used sand powder is mixed in a constant ratio is recovered to the sand supply unit (40).
    [49] On the other hand, when the sand powder recovered as described above is higher than the second sensor 72 of the sand supply unit 40, the opening and closing portion 81 of the sand storage unit 80 is closed by the control unit 90 and no longer. Supply of new sand powder is stopped.
    [50] By such a configuration, the new sand powder and the used sand powder are maintained at a constant ratio, thereby maintaining a constant etch rate for the glass wafer.
    [51] As described above, according to the present invention, the new sand powder and the used sand powder maintain a constant mixing ratio, whereby the etching rate can be kept constant at all times.
    [52] In addition, since the new sand powder is automatically supplied without the need to change the entire sand powder and measure the etch rate again after a certain time of use, the process time can be shortened.
    [53] As mentioned above, although this invention was shown and demonstrated with reference to the preferred embodiment for describing this invention, this invention is not limited to the structure and operation as it was shown and described. Rather, those skilled in the art will appreciate that many modifications and variations of the present invention are possible without departing from the spirit and scope of the appended claims. Accordingly, all such suitable changes and modifications and equivalents should be considered to be within the scope of the present invention.
    权利要求:
    Claims (4)
    [1" claim-type="Currently amended] An injection gun for spraying sand powder on the work plate by etching and etching, a sand supply unit for supplying sand powder to the spray gun side, a separator for separating sand powder and dust of the workpiece, and a sand separated by the separator In the sand blaster comprising a descending path that powder is moved to the sand supply,
    A sand storage unit including an opening and closing unit for selectively supplying new sand powder to the sand supply unit;
    A sensor unit installed in the sand supply unit to measure an amount of sand powder; And
    Sand Blaster comprising a; control unit for controlling the opening and closing in accordance with the signal of the sensor unit.
    [2" claim-type="Currently amended] The method of claim 1, wherein the sensor unit,
    A first sensor unit installed at a predetermined position of the sand supply unit; And
    And a second sensor unit disposed at a predetermined position on the upper side of the first sensor unit.
    [3" claim-type="Currently amended] The method according to claim 1 or 2, wherein the opening and closing portion,
    Sandblaster, characterized in that connected to one side of the descending path.
    [4" claim-type="Currently amended] The method according to claim 1 or 2, wherein the opening and closing portion,
    Sandblaster, characterized in that connected to one side of the sand supply.
    类似技术:
    公开号 | 公开日 | 专利标题
    EP2321093B1|2013-01-02|Vented cutting head body for abrasive jet system
    RU2288090C2|2006-11-27|Method and apparatus for removing surface layer and| sealing and| applying coating on solid surfaces
    US6758728B2|2004-07-06|Method and apparatus for cleaning polishing surface of polisher
    EP1754572B1|2008-01-09|Blasting apparatus and blasting method
    JP4688065B2|2011-05-25|Sponge blasting apparatus and sponge blasting method
    CN101439500B|2012-01-25|Blasting method and blasting machine
    US7267605B2|2007-09-11|Method and apparatus for abrasive recycling and waste separation system
    SU1087060A3|1984-04-15|Controlled arm of industrial robot
    KR19980063459A|1998-10-07|Secondary nozzle for cleaning and cleaning device and cleaning method using same
    DE102014104172B4|2016-09-15|Machine tool with cutting fluid filtration device
    US6371839B2|2002-04-16|Constant abrasive feeder of abrasive grains
    CA2267898C|2004-01-20|Method and apparatus for a powder metallurgical process
    US5562531A|1996-10-08|Abrasive brasting apparatus and die finishing apparatus using the same
    US8845393B2|2014-09-30|Cutting method by sandblasting
    EP1442835A1|2004-08-04|Method and apparatus for supplying process liquid for machine tool
    US5545074A|1996-08-13|Abrasive blasting system with waste water recycling
    US20050048873A1|2005-03-03|CNC abrasive fluid-jet milling
    WO1999037443A3|2000-08-24|Suction device for sand blasting and pressure nozzles
    CN101633154B|2011-05-18|Online high-pressure water-jet blasting surface cleaning system
    JP2002307312A|2002-10-23|Polishing device, polishing method, control program for letting computer execute polishing, and recording medium
    KR0162508B1|1999-10-01|Abrasive spray processing device and mold completion device using the same
    TWI300738B|2008-09-11|Cutting apparatus
    US20090114253A1|2009-05-07|Method of Substrate Processing, Substrate Processing System, and Storage Medium
    TWI522208B|2016-02-21|Nozzle processing device
    US20060130967A1|2006-06-22|Wafer machining apparatus
    同族专利:
    公开号 | 公开日
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    2003-02-05|Application filed by 삼성전자주식회사
    2003-02-05|Priority to KR1020030007280A
    2004-08-12|Publication of KR20040071358A
    优先权:
    申请号 | 申请日 | 专利标题
    KR1020030007280A|KR20040071358A|2003-02-05|2003-02-05|Sand blaster|
    [返回顶部]